What is GOB LED display?
GOB is on-board glue, used to obtain highly protective LED display. This is a new technology, similar to module packaging. It is working with the entire display module (such as 250 * 250mm) by using patented transparent glue to cover the PCB surface of the module. Thousands of SMD lights have been soldered on it, and finally the module has been obtained on its surface. Special shielding layer.
It has a highly protective LED display, which can achieve anti-collision (anti-collision), dust-proof, waterproof, moisture-proof, UV-proof, and will not have harmful effects on heat dissipation and brightness loss. Strict testing over a long period of time shows that the shielding glue even helps to dissipate heat, thereby extending the service life.
The revolutionary change that promotes the development of the entire LED display industry is that this GOB display is aimed at fine-pitch LED displays and rental screens, which have natural requirements for the protection of LED diodes.
What is COB LED display?
COB is a chip on board, which is a different chip packaging technology. All chips are directly integrated and packaged on a special PCB board. What we call packaging technology is to integrate three RGB led chips into an SMD electronic package. To produce a single SMD diode.
On the surface, COB sounds similar to GOB display technology, but it has a long history of development and has recently been adopted in promotional products of some major manufacturers.
Wide viewing angle, high color uniformity, high contrast, high power efficiency, etc. are the same characteristics as traditional LED technology. The most important thing is to use COB to obtain high protection performance, such as collision avoidance, moisture and dust resistance, in short, higher environmental adaptability, this Nanoshi led coating technology obtains pixel-level protection.
Obviously, COB technology will also obtain the same high protection display as GOB. In addition to cost, COB also has risks in the wavelength and color separation and the pickup of all chips on the board, which makes it difficult to obtain perfect color uniformity for the entire display. However, GOB can achieve good color uniformity because the modules are manufactured and tested in the same traditional way as ordinary modules before special gluing. The maintenance of COB is also an urgent problem to be solved.
As well as its own Delta enhanced COB technology, this technology can provide high brightness for small-pitch LED displays, which is three times that of most high-resolution LED displays (up to 3000Nits). It uses micro LEDs by placing three discrete red, green and blue monochromatic micro LEDs on the board.
Due to the small size of the COB LED display, there is no diameter of each LED. This makes the production process easier and less expensive. COB displays are proud of the heat resistance of high-density packaging.
Compared with SMD and DIP, COB LED is easy to install. Its ultra-thin PCB board can be made into a lightweight LED, which is very convenient no matter where the buyer wishes to carry it. This type of display screen encapsulates LED chips on a board, and these chips are cured with the help of epoxy resin. The best part of a COB display is that it can dissipate heat through the copper foil on the board.
Another important consideration is its anti-corrosion, anti-static, water-proof, anti-oxidation, dust-proof and moisture-proof functions, making this LED an important purchase product for various uses.
In the future, the mainstream display technology is micro-pitch Micro-LED. In theory, the pixel pitch can be infinitely small. It is a fine pitch display technology based on COB packaging.